Quick Answer
The Qualcomm Snapdragon 870 and MediaTek Dimensity 8050 are both upper-mid-range mobile platforms designed for capable performance. The Snapdragon 870, based on a 7nm process, is known for its strong single-core CPU performance and established GPU. The Dimensity 8050, built on a 6nm process, offers a more modern integrated 5G modem and slightly newer CPU core configuration.
Qualcomm Snapdragon 870 vs MediaTek Dimensity 8050: Full Comparison
Choosing the right chipset is a key factor in a smartphone’s overall experience, influencing everything from daily tasks to gaming and battery life. The Qualcomm Snapdragon 870 and MediaTek Dimensity 8050 are two prominent options often found in devices in a similar market segment. This comparison aims to break down their architectures, performance characteristics, and feature sets to help clarify their differences and similarities.
CPU Architecture and Performance
The core computing power of these two chipsets comes from different design philosophies.
- Snapdragon 870: Features a tri-cluster CPU with 1 high-performance Cortex-A77 core clocked at up to 3.2 GHz, 3 performance Cortex-A77 cores at 2.42 GHz, and 4 efficiency Cortex-A55 cores at 1.8 GHz. It is manufactured on a 7nm process. This setup typically provides excellent single-threaded performance, which is beneficial for certain app launches and tasks.
- Dimensity 8050: Also uses a tri-cluster design but with newer core types: 1 Cortex-A78 core at up to 3.0 GHz, 3 Cortex-A78 cores at 2.6 GHz, and 4 Cortex-A55 cores at 2.0 GHz. It is built on a more recent 6nm process, which can contribute to slightly better power efficiency. The performance in multi-core scenarios is generally competitive.
GPU and Gaming
Graphics performance is crucial for gaming and UI smoothness.
- Snapdragon 870: Utilizes the Adreno 650 GPU. This GPU has a strong reputation for consistent performance and wide developer support in games, often leading to good stability in graphics-intensive applications.
- Dimensity 8050: Equipped with the ARM Mali-G77 MC9 GPU. While capable, its real-world gaming performance can vary more depending on the device manufacturer’s optimization. It supports modern gaming features like HyperEngine optimizations.
Connectivity and Modem
This is one of the most distinct differences between the two platforms.
- Snapdragon 870: It typically pairs with the external Snapdragon X55 5G modem. This means the 5G connectivity is a separate component. It supports both sub-6GHz and mmWave 5G bands, though mmWave support depends on the device implementation.
- Dimensity 8050: Features an integrated 5G modem (within the chip itself). This design can be more power-efficient. It supports 5G dual SIM dual standby (DSDS), sub-6GHz networks, and advanced features like 5G carrier aggregation, but it does not support mmWave 5G in most regions.
AI, Imaging, and Additional Features
Both chips include dedicated processing units for AI and advanced camera features.
- AI Processing: The Snapdragon 870 uses the 6th Gen Qualcomm AI Engine, while the Dimensity 8050 employs MediaTek’s APU 3.0. Both are capable of handling AI-based camera enhancements, voice assistants, and other on-device AI tasks effectively.
- Camera Support: The Snapdragon 870’s Spectra 480 ISP can handle single cameras up to 200MP or dual 25MP cameras with zero shutter lag. The Dimensity 8050’s Imagiq 780 ISP supports single cameras up to 200MP or 32MP+16MP dual cameras. Both support 4K video recording.
- Display & Memory: The Snapdragon 870 supports QHD+ displays at 144Hz or 4K at 60Hz. The Dimensity 8050 supports FHD+ displays at up to 168Hz. Both support LPDDR5 RAM and UFS 3.1 storage.
Specification Comparison Table
| Feature | Qualcomm Snapdragon 870 | MediaTek Dimensity 8050 |
|---|---|---|
| Manufacturing Process | 7nm | 6nm |
| CPU Cores | 1x Cortex-A77 @ 3.2 GHz 3x Cortex-A77 @ 2.42 GHz 4x Cortex-A55 @ 1.8 GHz |
1x Cortex-A78 @ 3.0 GHz 3x Cortex-A78 @ 2.6 GHz 4x Cortex-A55 @ 2.0 GHz |
| GPU | Adreno 650 | ARM Mali-G77 MC9 |
| 5G Modem | External Snapdragon X55 (Sub-6 & mmWave) | Integrated 5G Modem (Sub-6 only) |
| AI Engine | 6th Gen Qualcomm AI Engine | MediaTek APU 3.0 |
| ISP (Image Signal Processor) | Spectra 480 ISP Up to 200MP single camera |
Imagiq 780 ISP Up to 200MP single camera |
| Max Display Support | QHD+ @ 144Hz / 4K @ 60Hz | FHD+ @ 168Hz |
| Memory Support | LPDDR5, UFS 3.1 | LPDDR5, UFS 3.1 |
| Video Capture | 8K @ 30fps, 4K HDR @ 60fps | 4K HDR @ 60fps |
| Wi-Fi Support | Wi-Fi 6 | Wi-Fi 6 |
Frequently Asked Questions
What is the main difference between the Snapdragon 870 and Dimensity 8050?
The most significant difference lies in the 5G modem and CPU architecture. The Snapdragon 870 uses an external modem and older Cortex-A77 cores clocked higher, while the Dimensity 8050 has an integrated 5G modem and uses newer Cortex-A78 cores on a slightly more efficient 6nm process.
Which chipset is better for gaming?
Both are capable for mobile gaming. The Snapdragon 870’s Adreno 650 GPU has a long track record of strong and consistent performance in games. The Dimensity 8050’s Mali-G77 MC9 is also powerful, but ultimate gaming performance can depend more on the specific device’s cooling and software tuning.
Does the Dimensity 8050 support mmWave 5G?
Typically, no. The MediaTek Dimensity 8050’s integrated modem supports sub-6GHz 5G networks. Support for mmWave 5G is generally found in the Snapdragon 870 platform, provided the smartphone manufacturer includes the necessary hardware.
Which one is more power-efficient?
On paper, the Dimensity 8050 has an advantage due to its 6nm manufacturing process and integrated modem design, which can lead to better power efficiency, especially during 5G connectivity. However, real-world battery life is heavily influenced by the smartphone’s overall design, battery capacity, and software optimization.
Final Thoughts
The Qualcomm Snapdragon 870 and MediaTek Dimensity 8050 represent two different approaches to delivering upper-mid-range performance. The Snapdragon 870 offers proven CPU and GPU performance with broad connectivity options, including potential mmWave support. The Dimensity 8050 counters with a more modern integrated 5G design, a newer CPU architecture, and a potentially more efficient manufacturing process. The choice between devices using these chipsets often comes down to specific priorities, such as the importance of integrated 5G, brand preference for GPU performance, and the other features offered by the complete smartphone package.